Intellectual property · Patent portfolio

12 patents on horizontal high-power LED structure

Since the first filing in 2010 we have protected chip structure, electrode layout, module reliability and manufacturing method separately. Registered in South Korea, the United States and Japan, with parallel PCT filings.

Total

South Korea · KR

United States · US

Japan · JP

Registered patents

No.

Filed

Jurisdiction

Title

Reg. no.

Count

2010

South Korea

Vertical LED with metal plating layer

—

2012

South Korea

Lateral power LED manufacturing

—

2013

South Korea

LED light module & lateral power LED

—

2014

South Korea · PCT

LED light module with improved reliability

—

2014–2016

United States

Horizontal power LED and manufacturing method

—

2017

Japan

Horizontal power LED and manufacturing method

—

The registration-number column is empty. Send the official numbers and dates and we will fill them in — this is the first item procurement and investment due diligence checks.

Scope of protection

The portfolio splits along four axes — chip structure (horizontal power LED), electrode layout (2D p-electrode), substrate and thermal design (metal substrate and plating), and module reliability. Working around any one leaves the rest.

Due diligence pack

Full texts, prosecution history and a claim comparison chart are available under NDA.

Request the pack